LT1766EFE/LT1956EFE

The LT1766EFE and the LT1956EFE are respectively identical to the LT1766EGN and LT1956EGN except for their “exposed pad” package which provides a 50% reduction in thermal resistance within a very compact footprint, allowing them to operate over a wider ambient temperature range without exceeding the maximum junction temperature of 125°C. The “exposed pad” package integrates a copper pad as the bottom of the TSSOP package providing a direct thermal path from the die to the PC board. This is particularly beneficial in applications that require high VIN/VOUT ratios and moderate output current levels, yet are confined to small solution footprints.

Both the LT1766 and LT1956 “family” utilize a high efficiency 1.5A, 0.2 Ohm switch, with the necessary oscillator, control and logic circuitry integrated into a single die. Special design techniques and a new high voltage process enable high efficiency over a wide input voltage range while the current mode topology enables fast transient response and excellent loop stability. Proprietary circuitry maintains peak switch current over the entire duty cycle range. Supply current is only 2.5mA, while shutdown current is reduced to 25