LED照明常用英文翻譯對(duì)照
高壓側(cè)highside
輸電系統(tǒng)powertransmissionsystem
輸電線(xiàn)transmissionline
固定串聯(lián)電容補(bǔ)償fixedseriescapacitorcompensation
穩(wěn)定stability
電壓穩(wěn)定voltagestability
功角穩(wěn)定anglestability
暫態(tài)穩(wěn)定transientstability
電廠(chǎng)powerplant
能量輸送powertransfer
交流AC
裝機(jī)容量installedcapacity
電網(wǎng)powersystem
落點(diǎn)droppoint
開(kāi)關(guān)站switchstation
雙回同桿并架double-circuitlinesonthesametower
變電站transformersubstation
補(bǔ)償度degreeofcompensation
高抗highvoltageshuntreactor
無(wú)功補(bǔ)償reactivepowercompensation
故障fault
調(diào)節(jié)regulation
裕度magin
三相故障threephasefault
故障切除時(shí)間faultclearingtime
極限切除時(shí)間criticalclearingtime
切機(jī)generatortriping
高頂值highlimitedvalue
強(qiáng)行勵(lì)磁reinforcedexcitation
線(xiàn)路補(bǔ)償器LDC(linedropcompensation)
機(jī)端generatorterminal
靜態(tài)static(state)
動(dòng)態(tài)dynamic(state)
單機(jī)無(wú)窮大系統(tǒng)onemachine-infinitybussystem
機(jī)端電壓控制AVR
電抗reactance
電阻resistance
功角powerangle
有功(功率)activepower
無(wú)功(功率)reactivepower
功率因數(shù)powerfactor
無(wú)功電流reactivecurrent
下降特性droopcharacteristics
斜率slope
額定rating
變比ratio
參考值referencevalue
電壓互感器PT
分接頭tap
下降率drooprate
仿真分析simulationanalysis
傳遞函數(shù)transferfunction
框圖blockdiagram
受端receive-side
裕度margin
同步synchronization
失去同步lossofsynchronization
阻尼damping
搖擺swing
保護(hù)斷路器circuitbreaker
電阻:resistance
電抗:reactance
阻抗:impedance
電導(dǎo):conductance
電納:susceptance
導(dǎo)納:admittance
電感:inductance
電容:capacitance
印制電路printedcircuit
印制線(xiàn)路printedwiring
印制板printedboard
印制板電路printedcircuitboard
印制線(xiàn)路板printedwiringboard
印制元件printedcomponent
印制接點(diǎn)printedcontact
印制板裝配printedboardassembly
板board
剛性印制板rigidprintedboard
撓性印制電路flexibleprintedcircuit
撓性印制線(xiàn)路flexibleprintedwiring
齊平印制板flushprintedboard
金屬芯印制板metalcoreprintedboard
金屬基印制板metalbaseprintedboard
多重布線(xiàn)印制板mulit-wiringprintedboard
塑電路板moldedcircuitboard
散線(xiàn)印制板discretewiringboard
微線(xiàn)印制板microwireboard
積層印制板buile-upprintedboard
表面層合電路板surfacelaminarcircuit
埋入凸塊連印制板B2itprintedboard
載芯片板chiponboard
埋電阻板buriedresistanceboard
母板motherboard
子板daughterboard
背板backplane
裸板bareboard
鍵盤(pán)板夾心板copper-invar-copperboard
動(dòng)態(tài)撓性板dynamicflexboard
靜態(tài)撓性板staticflexboard
可斷拼板break-awayplanel
電纜cable
撓性扁平電纜flexibleflatcable(FFC)
薄膜開(kāi)關(guān)membraneswitch
混合電路hybridcircuit
厚膜thickfilm
厚膜電路thickfilmcircuit
薄膜thinfilm
薄膜混合電路thinfilmhybridcircuit
互連interconnection
導(dǎo)線(xiàn)conductortraceline
齊平導(dǎo)線(xiàn)flushconductor
傳輸線(xiàn)transmissionline
跨交crossover
板邊插頭edge-boardcontact
增強(qiáng)板stiffener
基底substrate
基板面realestate
導(dǎo)線(xiàn)面conductorside
元件面componentside
焊接面solderside
導(dǎo)電圖形conductivepattern
非導(dǎo)電圖形non-conductivepattern
基材basematerial
層壓板laminate
覆金屬箔基材metal-cladbadematerial
覆銅箔層壓板copper-cladlaminate(CCL)
復(fù)合層壓板compositelaminate
薄層壓板thinlaminate
基體材料basismaterial
預(yù)浸材料prepreg
粘結(jié)片bondingsheet
預(yù)浸粘結(jié)片preimpregnatedbondingsheer
環(huán)氧玻璃基板e(cuò)poxyglasssubstrate
預(yù)制內(nèi)層覆箔板masslaminationpanel
內(nèi)層芯板corematerial
粘結(jié)層bondinglayer
粘結(jié)膜filmadhesive
無(wú)支撐膠粘劑膜unsupportedadhesivefilm
覆蓋層coverlayer(coverlay)
增強(qiáng)板材stiffenermaterial
銅箔面copper-cladsurface
去銅箔面foilremovalsurface
層壓板面uncladlaminatesurface
基膜面basefilmsurface
膠粘劑面adhesivefaec
原始光潔面platefinish
粗面mattfinish
剪切板cuttosizepanel
超薄型層壓板ultrathinlaminate
A階樹(shù)脂A-stageresin
B階樹(shù)脂B-stageresin
C階樹(shù)脂C-stageresin
環(huán)氧樹(shù)脂epoxyresin
酚醛樹(shù)脂phenolicresin
聚酯樹(shù)脂polyesterresin
聚酰亞胺樹(shù)脂polyimideresin
雙馬來(lái)酰亞胺三嗪樹(shù)脂bismaleimide-triazineresin
丙烯酸樹(shù)脂acrylicresin
三聚氰胺甲醛樹(shù)脂melamineformaldehyderesin
多官能環(huán)氧樹(shù)脂polyfunctionalepoxyresin
溴化環(huán)氧樹(shù)脂brominatedepoxyresin
環(huán)氧酚醛epoxynovolac
氟樹(shù)脂fluroresin
硅樹(shù)脂siliconeresin
硅烷silane
聚合物polymer
無(wú)定形聚合物amorphouspolymer
結(jié)晶現(xiàn)象crystallinepolamer
雙晶現(xiàn)象dimorphism
共聚物copolymer
合成樹(shù)脂synthetic
熱固性樹(shù)脂thermosettingresin[Page]
熱塑性樹(shù)脂thermoplasticresin
感光性樹(shù)脂photosensitiveresin
環(huán)氧值epoxyvalue
雙氰胺dicyandiamide
粘結(jié)劑binder
&nbs
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