Agilent Technologies Announces CoolPAM HBT-Based Power

Agilent Technologies Inc.  today announced its family of 4 mm by 4 mm power amplifier (PA) modules featuring CoolPAM technology. CoolPAM significantly reduces battery power consumption and allows mobile handsets to run cooler.

Agilent’s CoolPAM technology  uses advanced InGaP (indium gallium phosphide) HBT (heterojunction bipolar transistor) MMIC (microwave monolithic integrated circuit) technology to provide state-of-the-art reliability, temperature stability, cool operation and ruggedness. CoolPAM power amplifiers are already proven in handsets from leading manufacturers in Korea.

“Now Agilent offers handset manufacturers the choice of power amplifiers featuring E-pHEMT technology for the industry’s highest power-added efficiencies and InGaP HBT technology that provide the industry’s lowest average power consumption,” said Bryan Ingram, vice president and general manager of the Wireless Semiconductor Division in Agilent’s Semiconductor Products Group. “CoolPAM technology will be integrated into next-generation front-end modules that incorporate low-loss FBAR duplexers to dramatically extend the talk time of mobile handsets.”

The CoolPAM product line offers three versions of W-CDMA (wideband code division multiple access) power amplifier modules:

The WS2512 operates in the UMTS (Universal Mobile Telecommunications System) 2100 (1920 to 1980 MHz) frequency range for CDMA (code division multiple access) and W-CDMA handsets. UMTS2100 is a third-generation (3G) standard for regions of Europe and Asia that use GSM (Global System for Mobile Communications).

The WS2512 meets the stringent High-Speed Downlink Packet Access (HSDPA) linearity requirements for an output power of up to +27 dBm. In low-power mode in conjunction with a DC-DC converter, performance is 13 percent at +7 dBm output power with 8 mA quiescent current.

The WS2411 operates in the UMTS1900 (1850-1910 MHz) frequency range. Used in the Americas and the Caribbean, it meets HSDPA linearity requirements for output power of up to +28.5 dBm. In low-power mode in conjunction with a DC-DC converter, performance is 11 percent at +7 dBm output power with 13 mA quiescent current.

The WS2111 operates in the cellular band (824 to 849 MHz) and meets HSDPA linearity requirements at output power levels up to 27.5 dBm. In low-power mode in conjunction with a DC-DC converter, performance is 11 percent at +7 dBm output power with 10 mA quiescent current.

All versions of the CoolPAM W-CDMA product line can operate at 3.2 to 4.2 volts for compatibility with today’s low-current consumption designs. They all incorporate 50-ohm input and output matching networks for simple integration, and are equipped with a control pin that sets operating parameters for highest efficiency when operating at low-output power levels. The new PAs offer the lowest average operating current in the industry. All versions are compatible with HSDPA, a packet-based data service providing data transmission at up to 10 Mb/s, and 20 Mb/s for MIMO (multiple-input multiple-output) systems over a 5 MHz bandwidth.

The CoolPAM W-CDMA devices are supplied in a 4 mm x 4 mm x 1.4 mm, 10-pin surface-mount module designed to assure high thermal conductivity, which minimizes temperature rise for higher reliability. All versions are fabricated with an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability and ruggedness. Production volumes are expected by the third quarter of 2005.